已更新 扎克施耐德 ILA1F571PC1A0

CPU被做成产品之前被检出缺陷
这一个阶段也就是芯片tape out之后，应用到系统或者产品之前。
　　事实上，在现在的芯片设计中，在设计之初就已经为芯片的制造，测试，以及良率做考虑了。保证这一步能检测出芯片的缺陷，主要是DFT+ATE来保证。当然也有一些公司会做DFD和DFM。
　　ATE测试就是为了检查制造缺陷过程中的缺陷。芯片测试分两个阶段，一个是CP(Chip Probing)测试，也就是晶圆(Wafer)测试。另外一个是FT(Final Test)测试，也就是把芯片封装好再进行的测试。
所以在芯片被做成成品之前，每一片芯片都是经过量产测试才发货给客户的。
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