施耐德漏电开关 -*-新城网 ILA2T572PB1F0

CPU被做成产品之前被检出缺陷
这一个阶段也就是芯片tape out之后，应用到系统或者产品之前。
　　事实上，在现在的芯片设计中，在设计之初就已经为芯片的制造，测试，以及良率做考虑了。保证这一步能检测出芯片的缺陷，主要是DFT+ATE来保证。当然也有一些公司会做DFD和DFM。
　　ATE测试就是为了检查制造缺陷过程中的缺陷。芯片测试分两个阶段，一个是CP(Chip Probing)测试，也就是晶圆(Wafer)测试。另外一个是FT(Final Test)测试，也就是把芯片封装好再进行的测试。
所以在芯片被做成成品之前，每一片芯片都是经过量产测试才发货给客户的。
ILS1B853TC1A0
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ILS1M851PB1A0
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ILS2T852PC1A0
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ILS1F851S1366
ILS1F572PB1A0
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ILS1B573PB1A0
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ILS1B851PC1A0
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ILS1B852PB1A0
ILS1B852PC1A0
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ILS1B853PB1A0
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ILS1F571PB1A0
ILS1F571PC1A0
ILS1F573S1271
ILS1F851PB1A0
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ILS1F852PB1A0
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ILS1F853PC1F0
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ILS1R852PC1A0

ILS1R852PC1F0
ILS1R853PB1A0
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ILS1V571PB1A0
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ILS1V852PB1A0
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ILS1W573PB1A0
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ILS2D571PB1A0
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ILS2E571PB1A0
ILS2E571PC1A0
ILS2E572PB1A0

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ILA2E571TB1F0
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ILA2E572TB1A0
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ILA2E572TB2A0
ILA2E572TC1F0
ILA2E572TC2A0
ILA2K571PB1A0
ILA2K571PB1F0
ILA2K571PB2A0
ILA2K571PC1A0
ILA2K571PC1F0
ILA2K571PC2A0
ILA2K571TB1A0
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ILA2K571TC1F0
ILA2K571TC2A0
ILA2K572PB1F0
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ILA2K572TC1F0
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ILA2P571PB1A0
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ILA2P571PC1A0
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ILA2P571PC2A0
ILA2P571TB1A0
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ILA2P571TC1A0
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ILS三相步进技术
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ILS1B571PC1A0
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